| 000 | 01173nam a22002897a 4500 | ||
|---|---|---|---|
| 008 | 090609t xxu||||| |||| 00| 0 eng d | ||
| 020 | _a9781845691790 (cased) | ||
| 020 | _a1845691792 (cased) | ||
| 020 | _a9781420070835 (CRC) | ||
| 020 | _a9781845694043 (CRC e-book) | ||
| 082 |
_222 _a671.58 _bMIC |
||
| 245 |
_aMicrojoining and Nanojoining / _cEdited by Y. Zhou. |
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| 260 |
_aCambridge : _bWoodhead Pub. and Maney Publishing on behalf of The Institute of Materials, Minerals and Mining, _cc2008. |
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| 300 |
_axxiv, 810 p. : _bill. ; _c24 cm. |
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| 440 |
_a( Woodhead publishing in materials) _95973 |
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| 504 | _aIncludes bibliographical references and index. | ||
| 650 |
_aMetal bonding. _95974 |
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| 650 |
_aSealing (Technology) _95975 |
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| 650 |
_aMicroelectronics. _95976 |
||
| 650 |
_aMicrotechnology. _95977 |
||
| 650 |
_aNanoelectronics. _95978 |
||
| 650 |
_aNanotechnology. _95979 |
||
| 700 |
_aZhou, Y. _95980 |
||
| 710 |
_aInstitute of Materials, Minerals, and Mining. _95981 |
||
| 942 |
_2ddc _cBB |
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| 999 |
_c11783 _d11783 |
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| 952 |
_p000016797 _40 _epurchase _00 _u17152 _bMAIN _10 _o671.58 MIC _d2009-06-09 _8Alahram _h360 _70 _cLIB1 _2ddc _g1474 _yBB _aMAIN |
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