Silicon wafer bonding technology : for VLSI and MEMS applications / edited by Subramanian S. Iyer, IBM microelectronics division, Hopewell Junction, USA and Andre J. Auberton-Hervé, SOITEC, France.
Material type: TextSeries: EMIS processing series ; 1Publisher: London, United Kingdom : INSPEC, [2002]Copyright date: c2002Description: xxv, 149 pages : illustrations ; 26 cmContent type:- text
- unmediated
- volume
- 0852960395
- 621.38152 SIL 22
Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds |
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Book - Borrowing | Central Library First floor | Baccah | 621.38152 SIL (Browse shelf(Opens below)) | Available | 000049521 |
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621.38152 RAP Rapid thermal processing : | 621.38152 RAP Rapid thermal processing : | 621.38152 SHA Sold State Devices and Ciruits / | 621.38152 SIL Silicon wafer bonding technology : for VLSI and MEMS applications / | 621.38152 STR Solid State Electronic Devices / | 621.38152 STR Solid state electronic devices / | 621.38152 STR Solid state electronic devices / |
Includes glossary.
Includes appendices.
Includes bibliographical references and index.
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